Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2022-10-31 09:02:58.0
Alias: Feeder Power Board Brand: MITSUBOSHI/Samsung Applicable Machinery: Samsung Placement Machine Selection Principle: Economy, Applicability Warranty: 3 Month Quality: Top Quality High Light: J9060343a, J9060343a Stepping Feeder Board, J9060343a Samsung Board
Technical Library | 2016-02-04 19:11:47.0
In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.
Technical Library | 2019-10-30 23:46:39.0
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. (...) Energy efficiency is a major driver in the evolution of electronics and electronics packaging. To manage power consumption, portable appliances (smartphones, tablets, e-readers etc.) often use multiple supply voltages and DC/DC converters. Most are based on switch mode power conversion (SMPC). In a power converter, inductors and transformers are used to temporarily store energy during switching cycles. They also have the function of filtering noise. The power magnetics are often the largest and most expensive devices in the circuit. Integrating the magnetics into either a power converter module or system board can significantly reduce size and cost of the power converter function.
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
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